part number: XZM2CRK45W50MAV-6 3.5x2.8mm smd chip led lamp sep 20,2016 xdsb7162 v2-x layout: maggie l. p. 1/4 absolute maximum ratings (t a =25c) red (algainp) unit reverse voltage v r 5 v forward current i f 50 ma forward current (peak) 1/10 duty cycle 0.1ms pulse width i fs 150 ma power dissipation p d 160 mw operating temperature t a -40 ~ +85 c storage temperature tstg -40 ~ +85 package schematics red (algainp) unit forward voltage (typ.) (i f =50ma) v f 2.5 v forward voltage (max.) (i f =50ma) v f 3.2 v reverse current (max.) (v r =5v) i r 10 ua wavelength of peak emission cie127-2007* (typ.) (i f =50ma) p 640* nm wavelength of dominant emission cie127-2007*(typ.) (i f =50ma) d 625* nm spectral line full width at half-maximum (typ.) (i f =50ma) 20 nm capacitance (typ.) (v f =0v, f=1mhz) c 27 pf operating characteristics (t a =25c) part number emitting color emitting material lens-color wavelength cie127-2007* nm p viewing angle 2 1/2 min. typ. XZM2CRK45W50MAV-6 red algainp water clear 7000 2700* 10990 4790* 640* 60 luminous intensity cie127-2007* (i f =50ma) mcd attention observe precautions for handling electrostatic discharge sensitive devices a relative humidity between 40% and 60% is recommended in esd-protected work areas to reduce static build up during assembly process (reference jedec/jesd625-a and jedec/j-std-033) *luminous intensity value and wavelength are in accordance with cie127-2007 standards. features ideal for indication light on hand held products long life and robust package standard package: 500pcs/ reel msl (moisture sensitivity level): 3 rohs compliant notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.2(0.008") unless otherwise noted. 3. specifications are subjec t to change without notice.
part number: XZM2CRK45W50MAV-6 3.5x2.8mm smd chip led lamp sep 20,2016 xdsb7162 v2-x layout: maggie l. p. 2/4 ? red led is recommended for reflow soldering and soldering profile is shown below. red
part number: XZM2CRK45W50MAV-6 3.5x2.8mm smd chip led lamp sep 20,2016 xdsb7162 v2-x layout: maggie l. p. 3/4 ? the device has a single mounting surface. the device must be mounted according to the specifications. ? reel dimension ? recommended soldering pattern (units : mm; tolerance: 0.1) ? tape specification (units : mm) remarks: if special sorting is required (e.g. binn ing based on forward voltage, luminous intensity / luminous flux, or wavelength), the typical accuracy of the so rting process is as follows: 1. wavelength: +/-1nm 2. luminous intensity / luminous flux: +/-15% 3. forward voltage: +/-0.1v note: accuracy may depend on the sorting parameters.
part number: XZM2CRK45W50MAV-6 3.5x2.8mm smd chip led lamp sep 20,2016 xdsb7162 v2-x layout: maggie l. p. 4/4 terms of use 1. data presented in this document reflect statistical figures and should be treated as technical reference only. 2. contents within this document are subject to improvement and enhancement changes without notice. 3. the product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. user accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. the product(s) described in this document are intended for electronic applications in which a person?s life is not reliant u pon the led. please consult with a sunled representative for special applications where the led may have a direct impact on a person?s life. 5. the contents within this document may not be altered without prior consent by sunled. 6. additional technical notes are available at http://www.sunledusa.co m/technicalnotes.asp packing & label specifications
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